Apparatus wafer probing test
Layer 26 ~ 108
Material FR-4, Nelco, Panasonic (M6)
Thickness 3.2T ~ 10T
Pitch 0.3 ~ 0.8
Min Hole 0.127mm
Clearance 50um
Impedance Single 50 ohms , Diff 90 & 100 ohms
Surface Finish ENIG , Hard Gold
Option Blind & Buried via
& Capped and Filled via
Apparatus testing semiconductor
Layer 36 ~ 60
Material FR-4, Nelco
Thickness 4.8T ~ 6.35T
Pitch 0.3 ~ 1.0 pitch
Min Hole 0.127mm
Clearance 50um
Impedance Single 50 ohms , Diff 90 & 100 ohms
Surface Finish ENIG
Option Blind & Buried via
& Capped and Filled via
Semiconductor burn in test
Layer 2 ~ 28
Material Arlon, Nelco, ISOLA
Thickness 1.6T ~ 2.4T
Pitch 0.35 Fine pitch ~ 1.27
Min Hole 0.127mm
Clearance 50um
Impedance Single 50 ohms , Diff 90 & 100 ohms
Surface Finish ENIG , Hard Gold
Option Capped and Filled via
Brun - in test Dut Board
Layer 4 ~ 14
Material FR-4 High Tg, Arlon, ISOLA, Nelco
Thickness 1.2T ~ 1.6T
Pitch 0.27 Fine pitch ~ 0.8
Min Hole 0.127mm
Clearance 40um
Impedance Single 50 ohms
Surface Finish ENIG
Option Capped and Filled via or Thru hole type