Green IPMC is composed of people with at least 20 years of PCB experience and technology, and is operated in collaboration with the best partners in Korea to manufacture and supply products that meet customer needs.
Main Product
Probe Card
Specitication Application
Apparatus wafer probing test
Layer 26 ~ 108
Material FR-4, Nelco, Panasonic (M6)
Thickness 3.2T ~ 10T
Pitch 0.3 ~ 0.8
Min Hole 0.127mm
Clearance 50um
Impedance Single 50 ohms , Diff 90 & 100 ohms
Surface Finish ENIG , Hard Gold
Option Blind & Buried via
& Capped and Filled via
Layer 26 ~ 108
Material FR-4, Nelco, Panasonic (M6)
Thickness 3.2T ~ 10T
Pitch 0.3 ~ 0.8
Min Hole 0.127mm
Clearance 50um
Impedance Single 50 ohms , Diff 90 & 100 ohms
Surface Finish ENIG , Hard Gold
Option Blind & Buried via
& Capped and Filled via
Load Board
Specitication Application
Apparatus testing semiconductor
Layer 36 ~ 60
Material FR-4, Nelco
Thickness 4.8T ~ 6.35T
Pitch 0.3 ~ 1.0 pitch
Min Hole 0.127mm
Clearance 50um
Impedance Single 50 ohms , Diff 90 & 100 ohms
Surface Finish ENIG
Option Blind & Buried via
& Capped and Filled via
Layer 36 ~ 60
Material FR-4, Nelco
Thickness 4.8T ~ 6.35T
Pitch 0.3 ~ 1.0 pitch
Min Hole 0.127mm
Clearance 50um
Impedance Single 50 ohms , Diff 90 & 100 ohms
Surface Finish ENIG
Option Blind & Buried via
& Capped and Filled via
Burn in Board & MCC
Specitication Application
Semiconductor burn in test
Layer 2 ~ 28
Material Arlon, Nelco, ISOLA
Thickness 1.6T ~ 2.4T
Pitch 0.35 Fine pitch ~ 1.27
Min Hole 0.127mm
Clearance 50um
Impedance Single 50 ohms , Diff 90 & 100 ohms
Surface Finish ENIG , Hard Gold
Option Capped and Filled via
Burn in Dut Board (Socket Board)
Specitication Application
Brun - in test Dut Board
Layer 4 ~ 14
Material FR-4 High Tg, Arlon, ISOLA, Nelco
Thickness 1.2T ~ 1.6T
Pitch 0.27 Fine pitch ~ 0.8
Min Hole 0.127mm
Clearance 40um
Impedance Single 50 ohms
Surface Finish ENIG
Option Capped and Filled via or Thru hole type
iPMCRequest a free quote
- > Contact Us
jh12024@ipmc.co.krsales@ipmc.co.kr
- > Contact Us
jh12024@ipmc.co.kr
PCB Capabilities
4 ~ 120 layer PCB
Semiconductor Test equipment
- Load Board (0.35pitch)
- Probe Card (0.35pitch)
- Hi-Fix Board (0.3pitch)
- BIB (0.35pitch) HTOL , HAST
- MCC BIB
- Dut(socket) board : 0.27 pitch
Semiconductor Test equipment
- Load Board (0.35pitch)
- Probe Card (0.35pitch)
- Hi-Fix Board (0.3pitch)
- BIB (0.35pitch) HTOL , HAST
- MCC BIB
- Dut(socket) board : 0.27 pitch
- Stack via process
Our Products
Probe Card
Load Board
Load Board
Network Board
Burn in Board & MCC
Burn in Dut Board
HDI Board
Back Plane Board
Flex Board
Rigid Flex Board
Burn in Board & MCC
Burn in Dut Board
HDI Board
Back Plane Board
Flex Board
Rigid Flex Board
Stack via board(build up)